Polyimides

In a partnership with Asahi Kasei of Japan, AZ markets a photosensitive polyimide under the tradename PIMEL(TM), as well as the ancillary developers and rinses.

PIMEL photosensitive polyimide finds application as a passivation layer and stress buffer for advanced packaging, including "flip chip"-type wafer bumping.

• Photosensitive material
  processes like a photoresist using typical litho cell tools
• High heat and chemical resistance
  excellent electrical and mechanical properties
• Highly stable
  widely processable margin