Photoresists are light-sensitive materials used in several industrial processes, such as photolithography and photoengraving to form a patterned coating on a surface. Photoresists are either positive tone or negative tone and most pervasively used in the manufacture of integrated circuits and flat panel displays.

    Materials for the integrated circuit industry can be used for a wide variety of lithographic processes covering a wide range of exposure tools and processes. Applications range from sub-micron geometries to thick film applications. All materials are spin coated and can be matched to a large variety of substrates.

    Materials for the flat panel display industry can also be used for a wide variety of processes. Applications extend beyond the 5th generation spin coating, into advanced slit-coating processes. Materials are also available for roller coating and extrusion coating.



    • Good coating uniformity on large size glass substrates; reduced UROKO MURA.
    • Materials designed for high throughput, high dark erosion, and wide process margin
    • Good adhesion property on various metal films and ITO in both developing and etching processes

    IC Materials

    • Good coating uniformity up to 100 microns
    • Materials designed for high speed, high throughput, and wide process margins
    • Casting solvents compatible with industry standard EBR and pre-wet

    Photoresist for Customary Processes


    RFP series roll-coating positive-tone photoresist
    TFP series spin-coating positive-tone photoresist (higher photospeed)
    SZP series spin-coating positive-tone photoresist (lower photospeed)
    HKT series spin- and slit&spin-coating positive-tone photoresist (lower photospeed)
    SFP series slit&spin-coating positive-tone photoresist
    SR series slit-coating positive-tone photoresist (higher photospeed), half-tone capable
    SOP series slit-coating positive-tone photoresist (lower photospeed), half-tone capable

    Advanced Photoresist for Next-Generation Displays


    SZF series high-resolution photoresists for advanced half-tone technology
    SZC series advanced photoresists for Ti/Cu technology

    Specialized Photoresist


    AFP series photoresists for vertical aligning and other purposes
    RG series i-line photoresists
    SC4 series high-thermal photoresist for 4-mask technology
    CTP series negative-tone photoresists for OLED and other applications
    ANR series negative-tone photoresists for PMOLED
    LP series positive-tone i-line photoresist for AMOLEDRoller coating - RFP series - Roll Coat Positive-tone Photoresist for Flat Panel Display

    IC Photoresists


    g/line/Broadband/xover formulations for g-Line/h-Line exposures, and formulations that are suitable for both broadband and i-Line exposure
    5200-series Novolak-based formulations also suited for image-reversal

    Other formulations available, consult your AZ Account Manager



    MiR 700-series fast, cost-effective photoresists designed for replacement of 0.3 um and larger feature-size mid-range and crossover production products; these resists work well in both surfactant and non-surfactant containing tetramethylammonium hydroxide (TMAH) developers using standard conditions.

    Lift off Photoresists


    nLOF 2000-series TMAH-developable formulations for film thicknesses in range 2 - 7 um
    nLOF 5510 TMAH-developable formulation for sub-0.5 um feature sizes

    Specialty negative-tone i-Line formulations, using standard lithography processes, suitable for metal-lift-off applications

    Thick Film Photoresists (TFR)


    P4000-series workhorse TFR products, h-line/broadband capable positive-tone formulations, developed using inorganic developer systems
    9000-series i-Line positive-tone TFR with higher aspect ratios than P4000
    TPM 606 positive-tone photoresist tuned for g-Line, i-line and aligner exposure tools, ideal for wet etch applications
    10XT positive-tone novolak formulation for film thicknesses in the range of 5 to 25 um, sensitive to g/h/i-Line wavelengths, developable in either TMAH-type or inorganic developers
    40XT chemically-amplified positive-tone TFR, processed using TMAH-type developers
    nXT-series chemically-amplified negative-tone TFR for Cu RDL and TSV plating/etch applications

    Formulations suitable as metal plating masks, etch masks, large-feature lithography; film thickness from 1 um to 100um; specific formulations which work with inorganic as well as TMAH-type developers



    Photoresists are used by the various industries to manufacture many types of devices, including:

    • Flat Panel Displays
    • OLED
    • Color filter
    • e-paper
    • touch panel
    • Flash memory
    • Discrete and power
    • DRAM
    • CCD image sensors
    • Microprocessors
    • Hard disc drives
    • LED

    Advise on safety handling:

    Refer to the current Material Safety Data Sheet (MSDS) and product label for detailed information prior to handling.

    Storage conditions

    • Keep container tightly closed and dry in a cool, well-ventilated place.
    • Store at appropriate temperature. See label for details.
    • Store in original container.
    • Transport and store under dry conditions tightly closed and protected from heat and light.

    Shelf life

    Under recommended storage conditions, photoresists typically have at least three months shelf life, often six-months or more depending upon the formulation; contact your AZ Account Manager for more information

    Package types

    Recommended materials of construction include stainless steel, glass, ceramic, PTFE, polypropylene, and high density polyethylene.

    1-, 4-, 5-, 10-, and 200-liter package sizes are available, based upon the product formulation; contact your AZ Account Manager for more information.


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