• OVERVIEW

    AZ's anti-collapse rinse products provide wider process window capabilities for advanced 193nm photoresists.

    By applying the anti-collapse rinse after the photoresist development and DI water rinse steps, the pattern collapse behavior is significantly improved.

    Thus the photoresist film thickness can be increased to a level suitable for the substrate etch process while maintaining a manufacturable process window.

  • FEATURES & BENEFITS
    • Customized formulations
      compatible with widely-used photoresists; non-foaming electronic grade solution
    • PFOS-free components
      meets all regulatory requirements and initiatives
  • PRODUCT LIST
    • SPC-116A
    • SPC-124A
    • SPC-400
  • RELATED PRODUCTS

    Anti-collapse rinses are used in conjunction with the appropriate Photoresist designed for the targeted feature size and lithography exposure system

  • INDUSTRIES

    Anti-collapse rinses have be applied for layers where the substrate etch requirements are a key parameter in dense feature patterns.

    • Flash memory
    • DRAM
  • GOOD TO KNOW

    Advise on safety handling:

    Refer to the current Material Safety Data Sheet (MSDS) and product label for detailed information prior to handling.

    Storage conditions

    • Keep container closed.
    • Avoid contact with skin, eyes, and clothing.
    • Transport and store under dry conditions tightly closed.
    • Store at temperatures greater than 32 deg F. See label for details.
    • Keep from freezing.

    Shelf life

    Anti-collapse rinse products typically have a twelve-month shelf life under recommended storage conditions

    Package types

    Available in 18-liter canisters and 55-USGAL/200 liter bulk packaging

CONTACT US

Let us know how we can help

Speak to Elaine Kokinda on

1-908-295-0324